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| Surface Mount Chip LEDs Technical Data HSMx-C190/C170/ C150/C110 Features * * * * * Small Size Industry Standard Footprint Compatible with IR Solder Diffused Optics Operating Temperature Range of -30C to +85C * Right Angle Package Available * Five Colors Available * Available in 8 mm Tape on 7 in. (178 mm) Diameter Reels Description These chip LEDs are designed in an industry standard package for ease of handling and use. Five different LED colors are available in four compact, single color packages. The HSMx-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMx-C170 has the widely used 2.0 x 1.25 mm footprint. The HSMx-C190 has the industry standard 1.6 x 0.8 mm footprint, its low 0.8 mm profile and wide viewing angle make this LED exceptional for backlighting applications. The HSMx-C110 is a rightangle package with the universally accepted dimensions of 3.2 x 1.0 x 1.5 mm. This part is ideal for LCD backlighting and sidelighting applications. All packages are compatible with IR reflow solder processes. The small size and wide viewing angle make these LEDs prime choices for backlighting applications and front panel illumination especially where space is a premium. Applications * * * * * Keypad Backlighting Push-Button Backlighting LCD Backlighting Symbol Backlighting Front Panel Indicator Device Selection Guide Footprint (mm) 3.20 x 1.60 2.00 x 1.25 1.60 x 0.80 3.20 x 1.00[1] HER HSMS-C150 HSMS-C170 HSMS-C190 HSMS-C110 Orange HSMD-C150 HSMD-C170 HSMD-C190 HSMD-C110 Yellow HSMY-C150 HSMY-C170 HSMY-C190 HSMY-C110 Green HSMG-C150 HSMG-C170 HSMG-C190 HSMG-C110 AS AlGaAs Red HSMH-C150 HSMH-C170 HSMH-C190 HSMH-C110 Part per Reel 3000 4000 4000 3000 Note: Right-angle package 2 Package Dimensions LED DIE CATHODE (ANODE MARK FOR HSMH-C150) MARK CATHODE (ANODE MARK FOR MARK HSMH-C170) LED DIE 1.6 (0.063) 0.8 (0.031) 1.25 (0.049) 0.62 (0.024) 3.2 (0.126 ) 2.0 (0.079 ) DIFFUSED EPOXY 0.6 (0.024) 2.0 (0.079) POLARITY[3] DIFFUSED EPOXY 0.3 (0.012) 1.4 (0.055) POLARITY[3] 1.1 (0.043) PC BOARD CATHODE LINE 0.50 0.2 (0.020 0.008) 0.5 (0.020) 0.50 0.2 (0.020 0.008) PC BOARD 0.8 (0.031) CATHODE LINE 0.4 0.15 (0.016 0.006) 0.3 (0.012) 0.4 0.15 (0.016 0.006) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C150 CATHODE (ANODE MARK FOR HSMH-C190) MARK HSMx-C170 LED DIE CATHODE (ANODE MARK MARK FOR HSMH-C110) LED DIE 1.0 (0.039) 0.8 (0.031) 0.4 (0.016) 2.6 (0.102 ) 3.2 (0.126 ) CLEAR EPOXY 1.5 (0.059) PC BOARD 0.5 (0.020) POLARITY 1.6 (0.063 ) 1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD CATHODE LINE 0.3 0.15 (0.012 0.006) POLARITY[3] 0.8 (0.031) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 1.6 (0.063 ) CATHODE LINE 0.9 (0.035) 1.0 (0.039) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.) unless otherwise specified. 3. Polarity for HSMH-C1 x 0 will be the opposite of what is shown on above drawings. HSMx-C110 3 Absolute Maximum Ratings at TA=25C for HER, Orange, Yellow and Green Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR=100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMx-C150 25 100 65 5 95 -30 to +85 -40 to +85 HSMx-C170 HSMx-C190 HSMx-C110 20 20 25 100 100 100 52 52 65 5 5 5 95 95 95 -30 to +85 -30 to +85 -30 to +85 -40 to +85 -40 to +85 -40 to +85 See IR soldering profile (Figure 7) Units mA mA mW V C C C Absolute Maximum Ratings at TA=25C for AS AlGaAs Red Parameter DC Forward Current[1] Peak Pulsing Current[2] Power Dissipation Reverse Voltage (IR =100A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMx-C150 30 100 78 5 95 -30 to +85 -40 to +85 HSMx-C170 HSMx-C190 HSMx-C110 25 25 30 100 100 100 65 65 78 5 5 5 95 95 95 -30 to +85 -30 to +85 -30 to +85 -40 to +85 -40 to +85 -40 to +85 See IR soldering profile (Figure 7) Units mA mA mW V C C C Notes: 1. Derate linearly as shown in Figure 4 for temperature above 25C. 2. Pulse condition of 1/10 duty and 0.1 msec. width. Electrical Characteristics at TA=25C Part Number Color Forward Voltage VF(Volts) @ IF = 20 mA Typ. Max. 2.1 2.6 2.2 2.1 2.2 1.8 2.6 2.6 2.6 2.6 Reverse Breakdown VR(Volts) @ IR = 100 A Min. 5 5 5 5 5 Capacitance C(pF), @ VF = 0 V, f = 1 MHz Typ. 5 7 6 9 18 Thermal Resistance RJ-P (C/W) Typ. 400 250 400 250 400 250 400 250 460 300 HSMS-C150/110 HSMS-C170/190 HSMD-C150/110 HSMD-C170/190 HSMY-C150/110 HSMY-C170/190 HSMG-C150/110 HSMG-C170/190 HSMH-C150/110 HSMH-C170/190 HER Orange Yellow Green AlGaAs 4 Optical Characteristics at TA =25C Part Number HSMS-C150/170/190 HSMD-C150/170/190 HSMY-C150/170/190 HSMG-C150/170/190 HSMH-C150/170/190 HSMS-C110 HSMD-C110 HSMY-C110 HSMG-C110 HSMH-C110 Color HER Orange Yellow Green AlGaAs HER Orange Yellow Green AlGaAs Luminous Intensity[1] Iv(mcd)@20mA Min. Typ. 2.50 10.0 2.50 8.0 2.50 8.0 4.00 15.0 6.30 17.0 2.50 11.0 2.50 9.0 2.50 9.0 4.00 16.0 6.30 19.0 Peak Wavelength peak(nm) Typ. 630 605 589 570 660 630 605 589 570 660 Dominant Wavelength d(nm) Typ. 626 604 586 572 639 626 604 586 572 639 Viewing Angle 2 1/2() [2] Typ. 170 170 170 170 170 130 130 130 130 130 Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern, which may not be aligned with the mechanical axis of the lamp package. 2. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Color Bin Limits[1] Green Color Bins[1] Bin ID A B C D E Tolerance: 0.5 nm Yellow/Amber Color Bins[1] Bin ID A B C D E F Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0 Dom. Wavelength (nm) Min. Max. 561.5 564.5 564.5 567.5 567.5 570.5 570.5 573.5 573.5 576.5 Tolerance: 0.5 nm Orange Color Bins[1] Bin ID A B C D E F Tolerance: 1 nm Dom. Wavelength (nm) Min. Max. 597.0 600.0 600.0 603.0 603.0 606.0 606.0 609.0 609.0 612.0 612.0 615.0 5 Light Intensity (Iv) Bin Limits[1] Bin ID A B C D E F G H J K L M Intensity Min. 0.11 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 (mcd) Max. 0.18 0.29 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Bin ID N P Q R S T U V W X Y Intensity Min. 28.50 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 (mcd) Max. 45.00 71.50 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representative for information on currently available bins. Tolerance: 15% 1.0 GREEN RELATIVE INTENSITY AlGaAs YELLOW 0.5 ORANGE HER 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength. 100 IF - FORWARD CURRENT - mA IF MAX. - MAXIMUM FORWARD CURRENT - mA 1.6 AlGaAs LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 35 30 25 20 15 10 5 0 0 C150/C110 AlGaAs HER AlGaAs 10 GREEN 1.2 C150/C110 HER, ORANGE, YELLOW, GREEN C170/C190 AlGaAs 0.8 1 YELLOW 0.1 ORANGE 1.5 1.7 1.9 2.1 2.3 0.4 GaP 0 0 10 20 30 40 C170/C190 HER, ORANGE, YELLOW, GREEN RJ-A = 600C/W RJ-A = 800C/W 40 60 80 100 20 VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA TA - AMBIENT TEMPERATURE - C Figure 2. Forward Current vs. Forward Voltage. Figure 3. Luminous Intensity vs. Forward Current. Figure 4. Maximum Forward Current vs. Ambient Temperature. 6 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative Intensity vs. Angle for HSMx-C110. 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 TEMPERATURE 10 SEC. MAX. 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. 3C/SEC. MAX. ANGLE Figure 6. Relative Intensity vs. Angle for HSMx-C150, C170 and C190. Figure 7. Recommended Reflow Soldering Profile. Note: All dimensions in millimeters (inches). 7 0.8 (0.031) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) 1.2 (0.047) 0.9 (0.035) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) Figure 8. Recommended Soldering Pattern for HSMx-C150. Figure 9. Recommended Soldering Pattern for HSMx-C170. Figure 10. Recommended Soldering Pattern for HSMx-C190. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) USER FEED DIRECTION 1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) PRINTED LABEL CATHODE SIDE Figure 11. Recommended Soldering Pattern for HSMx-C110. Figure 12. Reeling Orientation. 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) O 20.20 MIN. (O 0.795 MIN.) O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Figure 13. Reel Dimensions. Note: All dimensions in millimeters (inches). 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 0.20 0.05 (0.008 0.002) 1.75 (0.069) 3.50 0.05 (0.138 0.002) DIM. A (SEE TABLE 1) 8.00 0.30 (0.315 0.012) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) 4.00 (0.157) CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C190 SERIES HSMx-C110 SERIES DIM. A DIM. B DIM. C 0.10 (0.004) 0.10 (0.004) 0.10 (0.004) 3.75 (0.148) 2.40 (0.094) 1.80 (0.071) 3.40 (0.134) 2.10 (0.083) 1.60 (0.063) 0.95 (0.037) 1.70 (0.067) 1.30 (0.051) 1.20 (0.047) 0.87 (0.034) 1.20 (0.047) HSMx-C110 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) R 1.0 0.05 (0.039 0.002) DIM. B (SEE TABLE 1) Figure 14. Tape Dimensions. END START Storage Condition: 5 to 30 C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 +/- 5C for 20 hours. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. www.agilent.com/semiconductors For product information and a complete list of distributors, please go to our web site. For technical assistance call: Americas/Canada: +1 (800) 235-0312 or (408) 654-8675 Europe: +49 (0) 6441 92460 China: 10800 650 0017 Hong Kong: (+65) 6271 2451 India, Australia, New Zealand: (+65) 6271 2394 Japan: (+81 3) 3335-8152(Domestic/International), or 0120-61-1280(Domestic Only) Korea: (+65) 6271 2194 Malaysia, Singapore: (+65) 6271 2054 Taiwan: (+65) 6271 2654 Data subject to change. Copyright (c) 2002 Agilent Technologies, Inc. Obsoletes 5988-1858EN April 30, 2002 5988-6271EN Figure 15. Tape Leader and Trailer Dimensions. Notes: 1. All dimensions in millimeters (inches). 2. Tolerance is 0.1 mm ( 0.004 in.)unless otherwise specified. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. |
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